Diagnosing Peeling & Base Exposure in Gold Layers
镀金层起皮与露底的诊断流程
标签：起皮, 露底, XRF分层测厚, 镍底应力, 有机污染
镀金件退货两大缺陷的排查：起皮若呈片状且背面光亮，多为镍底应力过大或镀液有机污染——先查瓦特镍浴糖精与十二烷基硫酸钠用量，再活性炭处理金浴；若起皮仅发生在焊缝与深凹处，则是活化不足，改用 10% 硫酸加少量氟化物活化 30–60 s。露底（透红）常因金厚不足或镍底过薄：XRF 分层测厚确认镍≥3 μm、金≥0.25 μm；滚镀薄金件露底集中在棱边，说明电流密度过高或金浓度偏低（应保持 8–12 g/L）。
Two common gold-plating returns: peeling with glossy flake backs points to nickel-strike stress or organics—check saccharin and lauryl sulfate dosing, then carbon-treat the gold bath; peeling confined to solder seams and recesses means poor activation, switching to 10% sulfuric acid with a little fluoride for 30–60 s. Base exposure (reddening) tracks thin gold or strike: XRF layer readings must show ≥3 μm nickel and ≥0.25 μm gold. Barrel-plated parts redden at edges—current density too high or gold concentration low (hold 8–12 g/L).