Pulse-Plated Fine-grain Gold & Gold Saving
脉冲镀金细化晶粒与省金工艺
标签：脉冲镀金, 省金, 晶粒细化, 硬金, 整流器
脉冲整流器（频率 500–2000 Hz、占空比 10–20%、峰值电流密度为直流的 3–5 倍）镀金可将晶粒从约 0.5 μm 细化到 50 nm 级，同等光泽下镀层厚度可减薄 30%，直接省金；硬金脉冲参数（酸性浴金浓度 2–4 g/L、45℃）兼顾耐磨性。调试要点：占空比过低镀层发雾，过高则趋近直流失去细化意义；长挂具需串联电感补偿并以示波器实测波形。腕表件以 0.5 μm 脉冲金通过 200 次酒精擦拭，验证其致密度优势。
Pulse plating at 500–2000 Hz, 10–20% duty and 3–5× DC peak density refines gold grains from ~0.5 μm to the 50 nm scale, allowing 30% thinner deposits at equal brightness—real gold savings; hard-gold parameters (acidic bath, 2–4 g/L Au, 45℃) add wear life. Watch duty: too low fogs the deposit, too high reverts to DC behavior; compensate long racks with series inductance and verify waveforms on an oscilloscope. A 0.5 μm pulse-gold layer passes 200 alcohol wipes on watch parts.
