Dry-film Photoresist and Laser Direct Imaging
干膜感光抗蚀与激光直接成像
标签：干膜抗蚀, LDI, 精细线宽, 对位
0.05 mm 级精细蚀刻弃用液态油墨，改用 PCB 行业干膜（如 DuPont Riston）：贴膜机 110 ℃ 热压辊贴合无气泡，LDI 激光直接成像省去底片，对位精度 ±10 μm；显影用 1% 碳酸钾 45 ℃，蚀后 3% 氢氧化钠退膜。缺点是设备投入高（二手 LDI 约 10–30 万元），适合徽章微字、精密滤网等高附加值订单。小工作室折中方案：喷墨底片输出 2400 dpi 图形，手工对位也能做到 ±0.05 mm。
For 0.05 mm-class work, drop liquid inks for PCB dry-film resist (e.g. DuPont Riston): laminate at 110 °C through heated rollers bubble-free, then Laser Direct Imaging skips film tooling at ±10 μm registration; develop in 1% potassium carbonate at 45 °C and strip in 3% NaOH. The barrier is capital—a used LDI runs ¥100k–300k—but it pays on micro-lettered badges and precision meshes. Budget workaround: inkjet film at 2400 dpi, hand-registered to about ±0.05 mm.
