Micro-stamping for Lead Frames
引线框架级微细冲压
标签：引线框架, 微冲压, 精密, 半导体
半导体引线框架用 0.15–0.25 mm 铜合金带（C194/C7025）冲压，引脚间距 0.4–0.5 mm、冲裁断面光亮带 ≥50%。模具凸凹模间隙取料厚 3–5%（普通冲压为 8–12%），模架温控 ±0.5 ℃ 防热漂；送料步距精度 ±0.01 mm 由凸轮箱伺服送料保证。车间需万级洁净（铜屑与油污造成塑封后腐蚀失效）。内引脚共面性 ≤0.05 mm 是关键验收指标。
Lead frames stamp from 0.15–0.25 mm copper strip (C194/C7025) at 0.4–0.5 mm lead pitch with ≥50% burnish band. Die clearance is 3–5% of thickness (vs 8–12% conventional), die sets are temperature-controlled to ±0.5 °C, and cam-box servo feeds hold ±0.01 mm pitch. ISO Class 7 cleanliness is required—copper dust and oils cause post-molding corrosion. Lead coplanarity ≤0.05 mm is the key acceptance criterion. ---