Laser-assisted Grooving for Inlay

激光辅助沟槽加工

type:tutorial · level:advanced · material:copper · material:silver · scale:jewelry · scale:decorative-object · equipment:laser · equipment:hand-tools · stage:engraving · stage:chasing

标签:激光沟槽, 深槽, 燕尾槽, 嵌线精度

光纤激光(20–50 W)按路径在铜面刻出 V/U 形镶嵌沟槽,深 0.3–1 mm、宽 0.1–0.5 mm,比手工錾槽效率高 10 倍且底宽一致——金银线压入后「底宽>口宽」的燕尾咬合需要手工再收口 0.05 mm 才锁死。激光热影响区约 0.1 mm,沟边氧化层退火后酸洗去除。适合规则几何纹样批量下料;自由曲线仍以手工錾槽为佳。

A 20–50 W fiber laser cuts V/U inlay grooves 0.3–1 mm deep, 0.1–0.5 mm wide—10× faster than chasing with uniform bottoms. Dove-tail locking (bottom wider than mouth) still needs 0.05 mm hand closing after the wire is driven in. The ~0.1 mm HAZ oxide pickles off after annealing. Laser suits regular geometric layouts; free-form curves still belong to the chasing hammer. ---