Cyanide-Free Electroless Gold Recipe
无氰化学镀金配方
标签：化学镀金, 无氰, 硫代硫酸盐, 氯金酸, 小批量
无氰化学镀金液：氯金酸 1–3 g/L、硫代硫酸盐络合剂 30–50 g/L、次亚磷酸钠还原剂 10 g/L、pH 5.5–6.5（柠檬酸缓冲）、温度 60–70℃，沉积速率 0.5–1 μm/h，可获 99.9% 纯金层。铜基体先闪镀镍 2–3 μm 防金铜扩散。镀液寿命约 4–6 个周期（MTO），老化液用螯合树脂回收金。规避氰化物风险，适合工作室小批量作业。
Cyanide-free electroless gold: chloroauric acid 1–3 g/L, thiosulfate complexant 30–50 g/L, sodium hypophosphite reducer 10 g/L, pH 5.5–6.5 (citrate buffer), 60–70℃; deposition 0.5–1 μm/h yielding 99.9% gold. Flash-nickel the copper 2–3 μm first to block Au-Cu diffusion. Bath life ~4–6 turns (MTO); reclaim gold from spent baths with chelating resin. Avoids cyanide hazards—suited to small studio batches. ---