Laser Selective Enamel Sintering
激光选择性珐琅烧结
标签：激光烧结, 选择性上釉, 能量密度, 数字化图案, 局部修复
以光纤激光（1064 nm，功率 30–60 W，扫描速度 200–800 mm/s，光斑 0.1 mm）对预置珐琅粉（100–200 目）逐层选择性烧结，无需整炉加热即可实现局部上釉与微细图案，热影响区 <0.5 mm。关键参数是能量密度 2–6 J/mm²：过低生烧、过高起泡。适合金属-珐琅交界面的补釉修复及数字化渐变图案制作。
A fiber laser (1064 nm, 30–60 W, 200–800 mm/s, 0.1 mm spot) selectively sinters pre-placed enamel powder (100–200 mesh) layer by layer, enabling local glazing and fine patterns without kiln firing; heat-affected zone <0.5 mm. The key parameter is energy density 2–6 J/mm²—too low under-fires, too high blisters. Ideal for touch-up at metal-enamel interfaces and digitally driven gradients. ---