Lead-Free Enamel Selection & Firing
无铅珐琅釉料选择与烧成
标签：无铅珐琅, 环保釉料, RoHS, 烧成温度, 釉料选择
无铅珐琅以硼硅酸盐体系替代铅釉，烧成温度略高（铜胎透明釉 800–830℃、不透釉 780–800℃），色彩饱和度接近但流动性差 5–10%，需延长保温 30–60 s 补偿。选购时核对 RoHS/EN 71-3 检测报告，铅含量 <0.1%。研磨粒度 80–120 目，湿法上釉浆比重 1.4–1.5 g/cm³。烧成后以 10% 硫酸 60℃ 酸洗去除面釉浮渣。
Lead-free enamels use borosilicate systems; firing is slightly hotter (transparent on copper 800–830℃, opaque 780–800℃), with near-equal saturation but 5–10% lower fluidity—extend hold 30–60 s. Verify RoHS/EN 71-3 reports (Pb <0.1%). Grind to 80–120 mesh; wet-application slip specific gravity 1.4–1.5 g/cm³. After firing, pickle in 10% sulfuric acid at 60℃ to remove scum. ---