Defect: Bare Spots & Seam Marks in Leaf
缺陷：贴金露底与衔接痕
标签：露底, 衔接痕, 胶层, 补金
贴金露底（显出铜色）因胶层过薄、局部未涂到或金箔撕裂。补金用小块金箔蘸水轻覆于露点，扫平压实。衔接痕明显者可在整体砑光时以玛瑙刀沿纹路顺压弱化。预防：胶要匀、箔要完整、环境无风无尘，大平面分块由内向外贴。
Bare copper shows when size is too thin, a spot missed, or leaf tore. Patch with a small leaf piece dabbed on water, swept and pressed. Visible seams soften by burnishing along the grain with an agate knife. Prevent with even size, intact leaf, still dust-free air, and laying large flat areas block by block from the center out. ---