Diagnosing Texture Loss and Pinholes in Moulds
翻模纹理丢失与针孔的根因诊断
标签：纹理丢失, 针孔, 脱模剂残留, 根因诊断
翻出的硅胶模细纹丢失，按序排查：①母模表面脱模剂或蜡膜残留填平了 0.1 mm 以下微纹——细纹母模可免涂脱模剂，铂金硅胶对干燥表面直接脱模；②真空脱泡过度——胶体沸腾翻花反把气泡打进细纹，粘度 12000 mPa·s 以上的硅胶脱泡不超过 2 min；③针孔密集多为母模吸湿——石膏模先 120 ℃ 烘 2 h 再涂封闭底胶。纹理呈渐次发钝常是单点浇注充型不满，改为多点位细流浇注、从最低点引入。
When fine texture fails to transfer, check in order: release-agent or wax residue filling sub-0.1 mm detail—skip release on fine masters, platinum silicone releases from dry surfaces as-tapped. Over-degassing, where boiling silicone drives bubbles into the grain—cap degassing at 2 min for viscosities above 12,000 mPa·s. Dense pinholes point to a damp master—bake plaster 2 h at 120 °C and seal first. Gradual texture softening means single-point pouring starving the detail; pour thin streams from the lowest point at multiple gates.