Laser-cut Blanking and Datum-hole Workflow for Repoussé
激光切割下料与定位孔錾刻流程
标签：激光切割, 下料, 定位基准, 浮雕
复杂轮廓浮雕坯用激光切割下料可省去手工锯切：先在 CAD 中把纹样外轮廓向背面顶凸区外偏移 15–20 mm 作为坯线，同时切出 2 个 φ2 mm 定位孔；正反面上胶盘时靠定位销对位，保证翻转錾刻时纹样错位不超过 0.3 mm。1.2 mm 紫铜切割速度约 0.9 m/min，切边仅轻微氧化，退火前用 400 目砂纸清掉毛刺即可。整块 300×300 mm 坯料下料时间由手工锯切的 40 min 缩至 3 min，轮廓复杂度越高收益越大。
Laser cutting replaces hand sawing for complex repoussé blanks: offset the ornament outline 15–20 mm beyond the pushed areas in CAD and cut two φ2 mm datum holes; pins on the pitch bowl keep front/back registration so chased detail misaligns by no more than 0.3 mm. On 1.2 mm copper cut at about 0.9 m/min the edge shows only light oxide; deburr with 400 grit before annealing. A 300×300 mm blank drops from 40 min of sawing to 3 min—the more complex the outline, the greater the gain.
