Laser Sintering of Local Enamel
激光局部烧结珐琅技术
标签：激光烧结, 局部补釉, 现场修复, 搭接率, 新技术
以 200–400 W 光纤或半导体激光对预敷釉浆区域扫描（功率 40–80%、速度 5–20 mm/s、光斑 0.5–1 mm），釉料在 2–5 s 内局部熔结，基体温升不超过 80℃，可实现"不上窑"的局部补釉与大型板材现场修复。要点：釉浆预烘须彻底（80℃×10 min）防汽化爆孔；扫描路径搭接率 50% 以上才能熔透。目前多用于航空厚膜釉与艺术品修复，首饰级细部仍需窑炉精烧收尾，两条路线可组合使用。
A 200–400 W fiber or diode laser scanning slip-coated zones (40–80% power, 5–20 mm/s, 0.5–1 mm spot) locally sinters enamel in 2–5 s with substrate heating under 80℃—out-of-kiln patch repair and on-site treatment of large panels. Keys: thorough slip pre-dry (80℃×10 min) to stop explosive outgassing, and ≥50% scan overlap for full melt. Main uses today are aerospace thick-film glazes and art restoration; jewelry-grade detail still finishes in a kiln, the two routes complementing.
